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Development of Solder Paste Wettability Evaluation Device for Surface Mounting #DigInfo
Development of Solder Paste Wettability Evaluation Device for Surface Mounting #DigInfo
 
May 1, 2015

With governmental support, SANYO SEIKO developed a wettability evaluation device for solder paste for use in surface mounting. The device, which was developed through collaboration between industry, academia, and the government, is already JIS certified. “In the past, a wetting…

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